SHANGHAI, Nov. 29, 2018 /PRNewswire/ -- Endura Technologies (International) Ltd. a leader in power management and smart audio solutions disrupting the mobile, server, and IOT markets today announced a commercial partnership with UNISOC (formerly Spreadtrum Communications) to deliver power, performance, and area improvements in the 12nm and 7nm advanced process nodes. This marks Endura's dedication and commitment to the China market having identified UNISOC to be the best partner to jointly pursue and increase competitiveness of China product manufacturers who adopt the improved and differentiated UNISOC products.

Endura and UNISOC have initiated their partnership by incorporating eTC™ into next generation chipsets and by jointly working with sVR™ to improve the performance and BOM costs of UNISOC products. Endura is proud to announce that latest high-end product offerings from UNISOC will include Endura's innovative power technologies. Endura's eVR™, sVR™, and eTC™ solutions provide unprecedented reduction in bill of material and power usage, while also increasing performance. Endura's technology will provide UNISOC with a competitive advantage in the advanced FinFET nodes through superior performance and increased battery life in a compact solution.

UNISOC, a leader in the Asia market, looks forward to using Endura's technology as it enables higher maximum frequency with reduced supply voltage improving power and performance at the transistor level through sub-nanosecond supply transient control. Endura's comprehensive platform solutions from battery to on-chip power mesh reduces component size enabling compact distributed power optimization, giving UNISOC a competitive edge with high-tier smartphones and 5G customers. Endura is proud to be partnered with UNISOC, such a large and substantial player in the market, and is committed to growing their product offerings to a broader market by offering them disruptive custom products.

"We are pleased to work with Endura as its innovative and customized solutions enhance the performance of various SoC platforms from UNISOC. Power management has always been a vital factor to evaluate chipset performance, and we are confident to say that through our cooperation with Endura, progress has been made on increasing the competitiveness of our products on the market," said Mr. John Rowland, SVP, UNISOC.

Endura's CEO, Dr. Taner Dosluoglu, was quoted saying, "We are very excited to start our operations in China and contribute to the success of much wider effort to increase global competitiveness of the China Semiconductor Industry. Together with UNISOC, we will introduce best-in-class power management solutions with differentiated power and performance benefits as well as provide area and cost advantages at the same time. This partnership will enhance our ability to disrupt the mobile electronics industry with a paradigm shift in performance versus area and cost."

As a core subsidiary of Tsinghua Unigroup, UNISOC is a leading fabless semiconductor company committed to the independent R&D of core chipsets in mobile communications and IoT. Its products cover mobile chipset platforms supporting 2G / 3G / 4G / 5G communication standards, RF chipsets, wireless connection chipsets, security chipsets, TV chipsets, and image sensor chipsets. With more than 4,500 staff, 14 R&D centers and 8 customer support centers around the world (as of Oct 2018), UNISOC has been one of the top 3 mobile baseband chipset suppliers in the world, the largest pan-chip provider in China, and the leading 5G communications chipset design company in China.

Endura Technologies (International) Ltd, with headquarters in Shanghai, China, is a fabless semiconductor company providing leading edge power management solutions for the microelectronics industry. We have developed patented disruptive system-level solutions for low-power mobile devices in the most advanced process nodes. Our two main focus areas are embedded power management for very demanding system-on-chip (SoC) CPU type applications, as well as stand-alone power management integrated circuits (PMICs). Our audio product line includes MEMS microphone IC delivering 70dB SNR in less than 1mW power consumption and integrated Cognitive Intelligent Audio and smart speaker drivers for the low impedance coil speakers as well as high voltage piezo electric speakers delivering low distortion high power high fidelity solutions in ultra-compact size.

Endura Technologies is a portfolio company of the Bridgewest Group.

Bridgewest Group, a closely held investment company which specializes in biotech, wireless communications, infrastructure for "internet of things," semiconductor, and real estate is headquartered in San Diego, California, and has operations across the USA, Europe and Asia.

Primarily investing at the seed stage, Bridgewest creates long-term value through the application of superior industry knowledge, operational expertise, and unwavering integrity to each opportunity. Over three decades of history, established success in innovation has prepared them and their portfolio to be leaders in the global community. The Group has been able to nurture entrepreneurs' ideas from design to global solutions repeatedly.

Bridgewest Group's accomplishments have been recognized internationally and our founders have been acclaimed as leaders and pioneers in the investment community by disrupting industries through innovation and leading-edge management methods. The Bridgewest Group has built a world class team of experienced professionals and is an opportunistic investor, creating long-term value through flexible hands-on mentoring and guidance.

SOURCE: Endura Technologies (International) Ltd.