For over twenty years, we’ve cultivated a high-impact ecosystem built to accelerate breakthrough IP in semiconductors and system design. Our portfolio companies are redefining what’s possible, from embedding AI directly onto silicon to building the infrastructure for next-gen connectivity.

Chaoyang Technologies patented the smallest chipset form factor with ultra-fast switching regulators. Endura Technologies reimagined power delivery with the highest-performing SoC and chiplet architecture to date. Qualcomm acquired Rapid Bridge's advanced techniques in integrated circuit development, reducing design complexity and optimizing die size and power consumption. Wavious introduced the first modular chiplet, enabling semiconductor teams to mix-and-match pre-developed components into a low-cost packing solution. The IP was so transformative that Wavious was acquired by a Fortune 3 company.